Kester 186 RMA FLUX

Soldering flux

The Kester 186 is of the RMA type. The flux residue after soldering is non-corrosive and non-conductive. Developed for critical applications where difficult assemblies must be soldered, but where process requirements stipulate the use of an RMA type flux.

This flux has high thermal stability for brazing multi-layer assemblies that may require a high preheat temperature or longer hold time. There is no degradation of surface insulation resistance caused by flux residue. The use of minimal ionic activating agents and the inactive nature of the residue allows the residue to be left on the PCB assemblies for many applications. The flux is also moisture and fungus resistant.